Koch-Chemie Fine Cut Pad is optimized for light defect removal, including holograms and towel marks. Koch-Chemie Fine Cut Pad was engineered to be used with Koch-Chemie Fine Cut F6.01. The thin profile (only 23 mm) provides effortless pad rotation as well as high levels of stability. The density of the Koch-Chemie Fine Cut Pad makes it easy to control, regardless of the type of buffer you're using. Koch-Chemie Fine Cut Pad feature a milled-edge that provides added versatility to fit around contours easier. The open-cell structure of the Koch-Chemie Fine Cut Pad ensures a long operating life by providing cooling for the pad.
