Koch-Chemie Micro Cut Pad is optimized for medium defect removal, including medium swirl marks and scratches. Koch-Chemie Micro Cut Pad was engineered to be used with Koch-Chemie Micro Cut M3.02 and Micro Cut & Finish P3.01. The thin profile (only 23 mm) provides effortless pad rotation as well as high levels of stability. The density of the Koch-Chemie Micro Cut Pad makes it easy to control, regardless of the type of buffer you're using. Koch-Chemie Micro Cut Pad feature a milled-edge that provides added versatility to fit around contours easier. The open-cell structure of the Koch-Chemie Micro Cut Pad ensures a long operating life by providing cooling for the pad.
